Kimala L. Laster
1Patents
1h-index
10Co-inventors
29Inventor score
Filing activity: Jan 25, 2018 → Jan 25, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10256202B1 | Durable bond pad structure for electrical connection to extreme environment microelectronic integrated circuits | Electricity | 3 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.