Durable bond pad structure for electrical connection to extreme environment microelectronic integrated circuits

US10256202B1 · kind B1 · utility

Assignee

• The United States of America as represented by the Administrator of the National Aeronautics and Space Administration · US

Inventors

• David J. Spry · Medina, US
• Dorothy Lukco · Sagamore Hills, US
• Philip G. Neudeck · Berea, US
• Carl Chang
• Liangyu Chen · Cleveland, US
• Roger D. Meredith · Cleveland, US
• Kelley M. Moses · Cleveland, US
• Charles A. Blaha · North Royalton, US
• Jose Gonzalez · Corona, US
• Glenn M. Beheim · Hiram, US
• Kimala L. Laster · Cleveland, US

Key dates

• Filing date: Jan 25, 2018
• Grant date: Apr 9, 2019
• Expiry date: Jan 25, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/3512
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A durable bond pad structure is described that facilitates highly durable electrical connections to semiconductor microelectronics chips (e.g., silicon carbide (SiC) chips) to enable prolonged operation over very extreme temperature ranges.