Ko-Pu WU
2Patents
0h-index
7Co-inventors
21Inventor score
Filing activity: Jun 14, 2019 → Nov 22, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11450596B2 | Lead frame, package structure and method for manufacturing the same | Electricity | 0 | Active |
| US11139225B2 | Device including a plurality of leads surrounding a die paddle and method for manufacturing the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.