Device including a plurality of leads surrounding a die paddle and method for manufacturing the same
US11139225B2 · kind B2 · utility
0Cited by
0References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 14, 2019 |
| Grant date | Oct 5, 2021 |
| Priority date | — |
| Expiry date | Jun 14, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device includes a die paddle and a plurality of leads. The leads surround the die paddle. Each of the leads includes an inner lead portion adjacent to and spaced apart from the die paddle, an outer lead portion opposite to the inner lead portion and a bridge portion between the inner lead portion and the outer lead portion. The inner lead portion has an upper bond section connected to the bridge portion and a lower support section below the upper bond section. A sum of a thickness of the upper bond section and a thickness of the lower support section is greater than a thickness of the bridge portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.