Kon Hoe Chin
1Patents
0h-index
13Co-inventors
23Inventor score
Filing activity: Dec 7, 2018 → Dec 7, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10777536B2 | Semiconductor package with air cavity | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.