Kousei Ushijima
2Patents
1h-index
7Co-inventors
30Inventor score
Filing activity: Mar 8, 2006 → May 25, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7786005B2 | Method for manufacturing semiconductor device to form a via hole | Electricity | 1 | Active |
| US7510967B2 | Method for manufacturing semiconductor device | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.