Kunio Koyabu
1Patents
1h-index
5Co-inventors
25Inventor score
Filing activity: Oct 9, 1986 → Oct 9, 1986
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4894706A | Three-dimensional packaging of semiconductor device chips | Emerging Cross-Sectional Technologies | 68 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.