Kwang Eung Lee
2Patents
2h-index
3Co-inventors
27Inventor score
Filing activity: Oct 21, 2003 → Jul 15, 2004
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7045893B1 | Semiconductor package and method for manufacturing the same | Electricity | 19 | Expired |
| US7138707B1 | Semiconductor package including leads and conductive posts for providing increased functionality | Electricity | 11 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.