Semiconductor package and method for manufacturing the same
US7045893B1 · kind B1 · utility
19Cited by
5References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 15, 2004 |
| Grant date | May 16, 2006 |
| Priority date | — |
| Expiry date | Jul 15, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package, and a method for fabricating the semiconductor package, includes a semiconductor die having a plurality of bond pads including a first bond pad positioned at a center of the bond pad and formed at a first surface of the semiconductor die and a second bond pad spaced from the first bond pad by a predetermined distance while surrounding the first bond pad. The semiconductor package includes first and second posts formed on the bond pads of the semiconductor die and a substrate formed with electrically conductive patterns corresponding to the bond pads of the semiconductor die and bonded to the post.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.