Kyeongbin Lim
3Patents
0h-index
11Co-inventors
28Inventor score
Filing activity: Jan 21, 2020 → Feb 3, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11581188B2 | Substrate bonding apparatus | Performing Operations; Transporting | 0 | Active |
| US11837573B2 | Chip bonding apparatus and method of manufacturing semiconductor device using the apparatus | Electricity | 0 | Active |
| US11443965B2 | Wafer to wafer bonding apparatuses | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.