Substrate bonding apparatus
US11581188B2 · kind B2 · utility
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2References
20Claims
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Key dates
| Filing date | Apr 7, 2020 |
| Grant date | Feb 14, 2023 |
| Priority date | — |
| Expiry date | Jun 30, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2457/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate bonding apparatus for bonding a first substrate to a second substrate includes a first bonding chuck supporting the first substrate, a second bonding chuck disposed above the first bonding chuck and supporting the second substrate, a resonant frequency detector detecting a resonant frequency of a bonded structure with the first substrate and the second substrate which are at least partially bonded to each other, and a controller controlling a distance between the first bonding chuck and the second bonding chuck according to the detected resonant frequency of the bonded structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.