Lan Peng
3Patents
2h-index
11Co-inventors
34Inventor score
Filing activity: Jan 19, 2015 → Feb 28, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10886252B2 | Method of bonding semiconductor substrates | Electricity | 6 | Active |
| US9632917B2 | Software testing | Physics | 2 | Active |
| US10141284B2 | Method of bonding semiconductor substrates | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.