Lance Cook
2Patents
1h-index
13Co-inventors
45Inventor score
Filing activity: Oct 20, 1997 → Jul 26, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5897375A | Chemical mechanical polishing (CMP) slurry for copper and method of use in integrated circuit manufacture | Chemistry; Metallurgy | 190 | Expired |
| US12227698B2 | Method of multi-stage fracturing of subterranean formation and slurry for that method | Fixed Constructions | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.