Lanping Bai
1Patents
1h-index
4Co-inventors
25Inventor score
Filing activity: Nov 26, 2014 → Nov 26, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9196557B1 | Protective packaging for integrated circuit device | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.