Lee Sun Lim
4Patents
2h-index
8Co-inventors
33Inventor score
Filing activity: Jun 24, 2008 → Dec 18, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9252172B2 | Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity region | Electricity | 31 | Active |
| US9171769B2 | Semiconductor device and method of forming openings through encapsulant to reduce warpage and stress on semiconductor package | Electricity | 2 | Active |
| US8110913B2 | Integrated circuit package system with integral inner lead and paddle | Electricity | 1 | Active |
| US9620557B2 | Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity region | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.