Leonard NEIBERG
2Patents
0h-index
8Co-inventors
21Inventor score
Filing activity: Dec 29, 2017 → Dec 28, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11652060B2 | Die interconnection scheme for providing a high yielding process for high performance microprocessors | Electricity | 0 | Active |
| US11127712B2 | Functionally redundant semiconductor dies and package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.