Functionally redundant semiconductor dies and package
US11127712B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2017 |
| Grant date | Sep 21, 2021 |
| Priority date | — |
| Expiry date | Sep 10, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06527
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Systems and methods of providing redundant functionality in a semiconductor die and package are provided. A three-dimensional electrical mesh network conductively couples smaller semiconductor dies, each including circuitry to provide a first functionality, to a larger base die that includes circuitry to provide a redundant first functionality to the semiconductor die circuitry. The semiconductor die circuitry and the base die circuitry selectively conductively couple to a common conductive structure such that either the semiconductor die circuitry or the base die circuitry is able to provide the first functionality at the conductive structure. Driver circuitry may autonomously or manually, reversibly or irreversibly, cause the semiconductor die circuitry and the base die circuitry couple to the conductive structure. The redundant first functionality circuitry improves the operational flexibility and reliability of the semiconductor die and package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.