Liang Hsia
1Patents
1h-index
2Co-inventors
22Inventor score
Filing activity: Dec 6, 2002 → Dec 6, 2002
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6706625B1 | Copper recess formation using chemical process for fabricating barrier cap for lines and vias | Electricity | 123 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.