Lichun Feng
1Patents
0h-index
4Co-inventors
19Inventor score
Filing activity: Jun 14, 2011 → Jun 14, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9464891B2 | Method for measuring thickness by pulsed infrared thermal wave technology | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.