Method for measuring thickness by pulsed infrared thermal wave technology
US9464891B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 14, 2011 |
| Grant date | Oct 11, 2016 |
| Priority date | — |
| Expiry date | May 20, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N25/72
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for measuring thickness or defect depth by pulsed infrared thermal wave technology is described. The method includes heating a measured object by pulsed heating devices, and at the same time, obtaining a thermal image sequence on the surface of the measured object by an infrared thermography device, and storing the thermal image sequence in a general-purpose memory. The method also includes multiplying a temperature-time curve at every point of the thermal image sequence by a corresponding time, thereby obtaining a new curve. The method also includes calculating a first-order differential and obtaining a peak time thereof. The method also includes use of one or more formulas to thereby determine the thickness or the defect depth of the measured object.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.