Lien-Chi Chan
7Patents
6h-index
8Co-inventors
45Inventor score
Filing activity: Dec 5, 2000 → Jul 27, 2004
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| USD529031S1 | IC card type circuit module | General | 38 | Expired |
| USD492314S1 | IC card type circuit module | General | 23 | Expired |
| US6847104B2 | Window-type ball grid array semiconductor package with lead frame as chip carrier and method for fabricating the same | Electricity | 19 | Expired |
| US6359342B1 | Flip-chip bumping structure with dedicated test pads on semiconductor chip and method of fabricating the same | Electricity | 14 | Expired |
| US6538321B2 | Heat sink with collapse structure and semiconductor package with heat sink | Electricity | 7 | Expired |
| US7339280B2 | Semiconductor package with lead frame as chip carrier and method for fabricating the same | Electricity | 6 | Expired |
| US6858931B2 | Heat sink with collapse structure for semiconductor package | Electricity | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.