Lien-Jin Chiang
4Patents
3h-index
8Co-inventors
43Inventor score
Filing activity: Mar 13, 2003 → Oct 22, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6776650B2 | Waterproof and heat-dissipating structure of electronic apparatus | Emerging Cross-Sectional Technologies | 24 | Expired |
| US7457133B2 | Electronic apparatus with natural convection structure | Electricity | 8 | Expired |
| US7445038B2 | Rotary total heat exchange apparatus | Mechanical Engineering; Lighting; Heating | 3 | Active |
| US11357097B2 | High performance thermal solution concept for surface mount device packages | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.