High performance thermal solution concept for surface mount device packages
US11357097B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 22, 2020 |
| Grant date | Jun 7, 2022 |
| Priority date | — |
| Expiry date | Dec 12, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10545
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Heat management in electronic components is an important factor in managing the performance and longevity of such electronic components. By omitting a thermal interface layer and providing thermal vias between a heatsink and an electronic component, such as a surface mount technology (SMT) package, such components may improve thermal transfer to the heatsink and simplify assembly. Thermal vias may be fused during reflow to the heatsink and/or electronic component. As a benefit to the improved heat transfer provided, electronic components may operate at a lower temperature or be configured to perform greater heat-producing activities.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.