Lin-Min Hung
1Patents
1h-index
6Co-inventors
25Inventor score
Filing activity: Feb 20, 2013 → Feb 20, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8841201B2 | Systems and methods for post-bonding wafer edge seal | Electricity | 6 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.