Lin Yee
1Patents
1h-index
2Co-inventors
22Inventor score
Filing activity: Jun 24, 2002 → Jun 24, 2002
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6940154B2 | Integrated circuit package and method of manufacturing the integrated circuit package | Electricity | 86 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.