Lingyan L. Tan
1Patents
0h-index
4Co-inventors
19Inventor score
Filing activity: Dec 16, 2015 → Dec 16, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10872832B2 | Pre-molded active IC of passive components to miniaturize system in package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.