Pre-molded active IC of passive components to miniaturize system in package

US10872832B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Mao Guo · Shanghai, CN
• John G. Meyers · Sacramento, US
• Yong She · Shanghai, CN
• Bin Liu · Fishers, US
• Lingyan L. Tan · Shanghai, CN

Key dates

• Filing date: Dec 16, 2015
• Grant date: Dec 22, 2020
• Expiry date: Dec 16, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/181
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A system in package and method of making as system in package are disclosed. The system in package has a substrate (102) with a plurality of passive devices (104) mounted thereon. A molding compound (106) envelopes the plurality of passive devices (104) to define a flat surface (116) substantially parallel to a surface of the substrate (102). A plurality of integrated circuit dies (110) is coupled successively to the flat surface (116).