Inventor · Monza, IT

Luigi Romano'

2Patents
2h-index
1Co-inventors
30Inventor score

Filing activity: Jul 14, 1987 → Oct 30, 1995

Most-cited inventions

PatentTitleAreaCited byStatus
US4887149A Semiconductor device mounted in a highly flexible, segmented package, provided with heat sink Electricity 39 Expired
US5653020A Method for forming plastic packages, in particular thin packages, for semiconductor electronic devices Emerging Cross-Sectional Technologies 16 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.