Semiconductor device mounted in a highly flexible, segmented package, provided with heat sink
US4887149A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jul 14, 1987 |
| Grant date | Dec 12, 1989 |
| Priority date | — |
| Expiry date | Jul 14, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package for semiconductor devices provided with an encased metallic heat sink, wherein an encapsulating body of resin extends beyond the perimenter of the heat sink to form two side extensions, diametrically opposite with respect to a central portion of the body and elastically de-coupled from such a central portion of the resin body containing the heat sink and the semiconductor chip, by means of at least a thinned out zone of the resin body determined by one or more pairs of opposite grooves. Fastening points contemplated in said lateral extensions, are efficiently elastically de-coupled from the central portion of the body and the package is essentially free to blend along said pairs of opposite grooves without inducing stresses on the encased metallic heat sink onto which rests the semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.