Ly Do
2Patents
1h-index
4Co-inventors
30Inventor score
Filing activity: Aug 5, 2016 → May 17, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10913879B2 | Thermally conductive pre-applied underfill formulations and uses thereof | Electricity | 1 | Active |
| US10927249B2 | Resin compositions for underfill film for three dimensional through silica via (TSV) packages and compositions useful for the preparation thereof | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.