Thermally conductive pre-applied underfill formulations and uses thereof
US10913879B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 5, 2016 |
| Grant date | Feb 9, 2021 |
| Priority date | — |
| Expiry date | Dec 28, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Provided herein are thermally conductive underfill compositions which have a combination of melt viscosity, glass transition temperature (Tg), coefficient of thermal expansion, and/or transparency that renders such materials useful for the preparation of a variety of electronic devices, such as flip chip packages, stacked dies, hybrid memory cubes, through-silica via (TSV) devices, and the like. In certain embodiments of the invention, there are provided assemblies comprising a first article permanently adhered to a second article by a cured aliquot of a formulation as described herein. In certain embodiments of the invention, there are provided methods for adhesively attaching a first article to a second article. In certain embodiments of the present invention, there are provided methods for improving heat dissipation by electronic devices assembled employing thermally conductive, but electrically non-conductive adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.