Lynn McNeil
1Patents
1h-index
5Co-inventors
25Inventor score
Filing activity: Sep 24, 1998 → Sep 24, 1998
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6133626A | Three dimensional packaging configuration for multi-chip module assembly | Electricity | 183 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.