M Clair Webb
1Patents
1h-index
3Co-inventors
25Inventor score
Filing activity: Jun 16, 2014 → Jun 16, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10068874B2 | Method for direct integration of memory die to logic die without use of thru silicon vias (TSV) | Electricity | 11 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.