Inventor · Yanai, JP

Manabu Kitano

4Patents
4h-index
9Co-inventors
39Inventor score

Filing activity: Sep 22, 1997 → Dec 14, 2001

Most-cited inventions

PatentTitleAreaCited byStatus
US6043114A Process for manufacturing a semiconductor wafer, a semiconductor wafer, process for manufacturing a semiconductor integrated circuit device, and semiconductor integrated circuit device Electricity 13 Expired
US6368905B1 Process for manufacturing a semiconductor wafer, a semiconductor wafer, process for manufacturing a semiconductor integrated circuit device, and semiconductor integrated circuit device Electricity 8 Expired
US6630375B2 Process for manufacturing a semiconductor wafer, a semiconductor wafer, process for manufacturing a semiconductor integrated circuit device, and semiconductor integrated circuit device Electricity 6 Expired
US6806130B2 Process for manufacturing a semiconductor wafer, a semiconductor wafer, process for manufacturing a semiconductor integrated circuit device, and semiconductor integrated circuit device Electricity 6 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.