Inventor · Burghausen, DE

Manuela Knipf

1Patents
1h-index
4Co-inventors
25Inventor score

Filing activity: Mar 25, 1988 → Mar 25, 1988

Most-cited inventions

PatentTitleAreaCited byStatus
US4900363A Method and liquid preparation for removing residues of auxiliary sawing materials from wafers Chemistry; Metallurgy 5 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.