Method and liquid preparation for removing residues of auxiliary sawing materials from wafers

US4900363A · kind A · utility

Assignee

• Wacker-Chemitronic Gesellschaft fur Elektronik Grundstoffe mbH · DE

Inventors

• Gerhard Brehm · Emmerting, DE
• Manuela Knipf · Burghausen, DE
• Rudolf Mayrhuber
• Jurgen Schuhmacher · Haiming, DE
• Max Stadler · Haiming, DE

Key dates

• Filing date: Mar 25, 1988
• Grant date: Feb 13, 1990
• Expiry date: Mar 25, 2008

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C11D7/265
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

A process and liquid preparation is disclosed for removing residues from ers sawn from crystalline rods. In sawing rod-shaped workpieces such as semiconductor rods, for example, into wafers, by means of an internal-hole saw, auxiliary sawing materials such as for example cutting strips are often attached to the rods. According to the present invention, the residues of such auxiliary sawing materials remaining on the wafers obtained after the sawing operation can be removed particularly easily by means of immersion in baths of aqueous carboxylic solutions and, in particular, aqueous formic acid.