Mario Pita
6Patents
3h-index
12Co-inventors
46Inventor score
Filing activity: Sep 16, 1999 → Aug 10, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6566269B1 | Removal of post etch residuals on wafer surface | Electricity | 13 | Expired |
| US6406999B1 | Semiconductor device having reduced line width variations between tightly spaced and isolated features | Electricity | 10 | Expired |
| US6395639B1 | Process for improving line width variations between tightly spaced and isolated features in integrated circuits | Electricity | 8 | Expired |
| US7087498B2 | Method for controlling trench depth in shallow trench isolation features | Electricity | 3 | Expired |
| US6136615A | Migration from control wafer to product wafer particle checks | Electricity | 1 | Expired |
| US7700491B2 | Stringer elimination in a BiCMOS process | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.