Mark A. De Samber
6Patents
4h-index
9Co-inventors
39Inventor score
Filing activity: Nov 21, 1995 → Jun 30, 1999
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6177295A | "Method of manufacturing semiconductor devices with ""chip size package""" | Electricity | 30 | Expired |
| US6188749A | X-ray examination apparatus comprising a filter | Physics | 19 | Expired |
| US5814554A | Semiconductor device provided with a microcomponent having a fixed and a movable electrode | Performing Operations; Transporting | 17 | Expired |
| US6064074A | Semiconductor cathode and electron tube comprising a semiconductor cathode | Electricity | 4 | Expired |
| US5948233A | Method of manufacturing an electric component which can be mounted on the surface of a printed circuit board | Emerging Cross-Sectional Technologies | 4 | Expired |
| US6125026A | Electric component which can be mounted on the surface of a printed circuit board as well as a method of manufacturing such components | Emerging Cross-Sectional Technologies | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.