Semiconductor device provided with a microcomponent having a fixed and a movable electrode
US5814554A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 21, 1995 |
| Grant date | Sep 29, 1998 |
| Priority date | — |
| Expiry date | Nov 21, 2015 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0728
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of manufacturing a semiconductor device is disclosed in which semiconductor switching elements (2) and an integrated microcomponent (3) with a fixed electrode (6) and an electrode (7) which is movable relative to the fixed electrode (6) are provided adjacent a surface of a semiconductor slice (1), which slice (1) is subsequently subdivided into individual semiconductor devices. After the semiconductor switching elements (2) have been provided, metal conductor tracks (20) of a first level are provided on the surface which form the fixed electrode (6) and electrical connections (9), over which an insulating layer (21) and metal conductor tracks (22) of a second level are provided, which form the movable electrode (7) and further electrical connections (8), after which the insulating layer (21) between the fixed (6) and the movable electrode (7) is removed. The semiconductor switching elements (2) are thus manufactured first, after which during the application of the metallization of the device the microcomponent (3) is also manufactured. Since the electrodes (6, 7) of the microcomponent are manufactured by means of conductor tracks (20, 22) at the two metallization levels, i…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.