Mark Daniel Derwin
2Patents
2h-index
5Co-inventors
27Inventor score
Filing activity: Feb 20, 1996 → Jun 14, 1996
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5731547A | Circuitized substrate with material containment means and method of making same | Electricity | 8 | Expired |
| US5827386A | Method for forming a multi-layered circuitized substrate member | Electricity | 5 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.