Method for forming a multi-layered circuitized substrate member
US5827386A · kind A · utility
5Cited by
12References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 14, 1996 |
| Grant date | Oct 27, 1998 |
| Priority date | — |
| Expiry date | Jun 14, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0094
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The ends of thru-holes, disposed in components that are laminated together to form a composite structure are masked prior to lamination of the components to prevent bonding material bleed through the holes during the lamination process. The method effectively solves the problem of the need to remove laminate bleed from the outer surface of the composite structure after the joining process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.