Mark Thurston
4Patents
3h-index
8Co-inventors
39Inventor score
Filing activity: Mar 5, 1997 → Nov 26, 2003
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5883782A | Apparatus for attaching a heat sink to a PCB mounted semiconductor package | Electricity | 135 | Expired |
| US6046905A | Dual spring clip attachment mechanism for controlled pressure interface thermal solution on processor cartridges | Electricity | 31 | Expired |
| US6381136B1 | Dual spring clip attachment mechanism for controlled pressure interface thermal solution on processor cartridges | Electricity | 17 | Expired |
| US7152313B2 | Package substrate for integrated circuit and method of making the substrate | Emerging Cross-Sectional Technologies | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.