Marvin Gestole
5Patents
4h-index
14Co-inventors
50Inventor score
Filing activity: Jan 18, 2000 → Jun 5, 2009
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6762067B1 | Method of packaging a plurality of devices utilizing a plurality of lead frames coupled together by rails | Emerging Cross-Sectional Technologies | 80 | Expired |
| US7122884B2 | Robust leaded molded packages and methods for forming the same | Electricity | 56 | Expired |
| US7906837B2 | Robust leaded molded packages and methods for forming the same | Electricity | 27 | Active |
| US7402462B2 | Folded frame carrier for MOSFET BGA | Electricity | 4 | Active |
| US7560311B2 | Robust leaded molded packages and methods for forming the same | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.