Masao Saika
2Patents
2h-index
2Co-inventors
30Inventor score
Filing activity: Dec 3, 2001 → Oct 18, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6573596B2 | Non-rectangular thermo module wafer cooling device using the same | Emerging Cross-Sectional Technologies | 29 | Expired |
| US7607471B2 | Temperature control device | Mechanical Engineering; Lighting; Heating | 3 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.