Non-rectangular thermo module wafer cooling device using the same
US6573596B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 3, 2001 |
| Grant date | Jun 3, 2003 |
| Priority date | — |
| Expiry date | Dec 3, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S257/93
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A non-rectangular thermo module is formed by disposing a plurality of Peltier devices between a pair of heat radiating plates, wherein the heat radiating plate has a circular or straight outer peripheral contour portion and inner peripheral contour portion and right/left side edge contour portions connecting the outer peripheral contour portion and the inner peripheral contour portion and the outer peripheral contour portion is formed longer than the inner peripheral contour portion while the right/left side edge contour portions contain first straight lines which are not parallel and inclined toward the inner peripheral contour portion such that they narrow gradually, the first straight lines being provided at least in part of the right/left side edge contour portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.