Masaya Shima
12Patents
2h-index
17Co-inventors
47Inventor score
Filing activity: May 26, 2009 → Sep 9, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7985663B2 | Method for manufacturing a semiconductor device | Electricity | 6 | Active |
| US9190373B2 | Bump structure with underbump metallization structure and integrated redistribution layer | Electricity | 3 | Active |
| US10546769B2 | Semiconductor manufacturing method and semiconductor manufacturing device | Electricity | 1 | Active |
| US10199253B2 | Method for manufacturing semiconductor devices through peeling using UV-ray | Electricity | 0 | Active |
| US9646908B2 | Method for manufacturing semiconductor device and semiconductor device | Electricity | 0 | Active |
| US11996335B2 | Manufacturing method of semiconductor device | Electricity | 0 | Active |
| US11107788B2 | Method of manufacturing semiconductor device | Electricity | 0 | Active |
| US10741505B2 | Method of manufacturing semiconductor device and semiconductor device | Electricity | 0 | Active |
| US10804152B2 | Method of manufacturing semiconductor device | Electricity | 0 | Active |
| US10475675B2 | Manufacturing apparatus and manufacturing method of semiconductor device | Electricity | 0 | Active |
| US10211165B2 | Method of manufacturing semiconductor device and semiconductor device | Electricity | 0 | Active |
| US11804471B2 | Method for manufacturing semiconductor device and semiconductor manufacturing apparatus | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.