Masayoshi Harada
2Patents
2h-index
12Co-inventors
34Inventor score
Filing activity: Dec 19, 2003 → Mar 7, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7550176B2 | Method of forming coating film on aluminum substrate | Performing Operations; Transporting | 8 | Expired |
| US7393706B2 | Method of manufacturing optical semiconductor device, package molding jig, method of manufacturing package molding jig and manufacturing apparatus for package molding jig | Electricity | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.