Method of manufacturing optical semiconductor device, package molding jig, method of manufacturing package molding jig and manufacturing apparatus for package molding jig
US7393706B2 · kind B2 · utility
2Cited by
2References
19Claims
0Family size
Assignee
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Key dates
| Filing date | Mar 7, 2005 |
| Grant date | Jul 1, 2008 |
| Priority date | — |
| Expiry date | Dec 18, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/852
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of manufacturing an optical semiconductor device includes preparing an optical semiconductor provided on a distal end of a first lead portion of a lead frame and connected electrically with a distal end of a second lead portion of the lead frame, forming thermoplastic resin for preparing a package molding jig having a concave portion corresponding to a contour of a package of the optical semiconductor device, inserting the distal ends of the lead portions into the concave portion of the package molding jig for positioning and fixing, and filling packaging resin in the concave portion of the package molding jig.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.