Matt Shea
1Patents
0h-index
2Co-inventors
16Inventor score
Filing activity: Dec 19, 2013 → Dec 19, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9293440B2 | Method for interconnecting die and substrate in an electronic package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.