Matthew G. Bausch
1Patents
0h-index
3Co-inventors
19Inventor score
Filing activity: Jan 3, 2014 → Jan 3, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9209082B2 | Methods of localized hardening of dicing channel by applying localized heat in wafer kerf | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.